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? semiconductor components industries, llc, 2016 october, 2016 ? rev. 21 1 publication order number: mc74hc4851a/d mc74hc4851a, mc74hc4852a analog multiplexers/ demultiplexers with injection current effect control automotive customized these devices are pin compatible to standard hc405x and mc1405xb analog mux/demux devices, but feature injection current effect control. this makes them especially suited for usage in automotive applications where voltages in excess of normal logic voltage are common. the injection current effect control allows signals at disabled analog input channels to exceed the supply voltage range without affecting the signal of the enabled analog channel. this eliminates the need for external diode/resistor networks typically used to keep the analog channel signals within the supply voltage range. the devices utilize low power silicon gate cmos technology. the channel select and enable inputs are compatible with standard cmos outputs. features ? injection current cross?coupling less than 1 mv/ma (see figure 10) ? pin compatible to hc405x and mc1405xb devices ? power supply range (v cc ? gnd) = 2.0 to 6.0 v ? in compliance with the requirements of jedec standard no. 7 a ? chip complexity: 154 fets or 36 equivalent gates ? nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable ? these devices are pb?free, halogen free and are rohs compliant this document contains information on some products that are still under development. on semiconductor reserves the right to change or discontinue these products without notice. www. onsemi.com marking diagrams soic?16 tssop?16 1 16 hc485xag awlyww hc48 5xa alyw 1 16 x = 1 or 2 a = assembly location wl, l = wafer lot yy, y = year ww, w = work week g or = pb?free package soic?16 wide 1 16 hc4851a awlywwg see detailed ordering and shipping information in the package dimensions section on page 12 of this data sheet. ordering information soic?16 d suffix case 751b tssop?16 dt suffix case 948f soic?16 wide dw suffix case 751g (note: microdot may be in either location) qfn16 mn suffix case 485aw 1 4851 alyw qfn16* *v4851 marking used for nlv74hc4851amn1twg
mc74hc4851a, mc74hc4852a www. onsemi.com 2 figure 1. mc74hc4851a logic diagram single?pole, 8?position plus common off x0 13 x1 14 x2 15 x3 12 x4 1 x5 5 x6 2 x7 4 a 11 b 10 c 9 enable 6 multiplexer/ demultiplexer x 3 analog inputs/ channel inputs pin 16 = v cc pin 8 = gnd common output/ input 15 16 14 13 12 11 10 2 1 34567 v cc 9 8 x2 x1 x0 x3 a b c x4 x6 x x7 x5 enable nc gnd figure 2. mc74hc4851a 16?lead pinout (top view) outputs select l l l l h h h h x l l h h l l h h x l h l h l h l h x function table ? mc74hc4851a control inputs on channels enable select cba x0 x1 x2 x3 x4 x5 x6 x7 none l l l l l l l l h 116 215 314 413 512 611 710 89 gnd v cc c gnd x4 x7 x x6 n c enable x5 x3 x0 x1 x2 b a figure 3. mc74hc4851a qfn pinout figure 4. mc74hc4852a logic diagram double?pole, 4?position plus common off x0 12 x1 14 x2 15 x3 11 y0 1 y1 5 y2 2 y3 4 a 10 b 9 enable 6 x switch y switch x 13 analog inputs/outputs channel\select inputs pin 16 = v cc pin 8 = gnd common outputs/inputs l l h h x l h l h x function table ? mc74hc4852a control inputs on channels enable select ba x0 x1 x2 x3 l l l l h x = don?t care figure 5. mc74hc4852a 16?lead pinout (top view) 15 16 14 13 12 11 10 2 1 34567 v cc 9 8 x2 x1 x x0 x3 a b y0 y2 y y3 y1 enable nc gnd y 3 y0 y1 y2 y3 none
mc74hc4851a, mc74hc4852a www. onsemi.com 3 ??????????????????????? ??????????????????????? v cc positive dc supply voltage (referenced to gnd) ?0.5 to +7.0 v v in dc input voltage (any pin) (referenced to gnd) ?0.5 to v cc + 0.5 v i dc current, into or out of any pin 25 ma p d power dissipation in still air, soic package? tssop package? 500 450 mw t stg storage temperature range ?65 to +150 c t l lead temperature, 1 mm from case for 10 seconds soic or tssop package 260 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ?derating: soic package: ?7 mw/ c from 65 to 125 c tssop package: ?6.1 mw/ c from 65 to 125 c recommended operating conditions symbol parameter min max unit v cc positive dc supply voltage (referenced to gnd) 2.0 6.0 v v in dc input voltage (any pin) (referenced to gnd) gnd v cc v v io * static or dynamic voltage across switch 0.0 1.2 v t a operating temperature range, all package types ?55 +125 c t r , t f input rise/fall time v cc = 2.0 v (channel select or enable inputs) v cc = 4.5 v v cc = 6.0 v 0 0 0 1000 500 400 ns functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability. *for voltage drops across switch greater than 1.2 v (switch on), excessive v cc current may be drawn; i.e., the current out of the switch may contain both v cc and switch input components. the reliability of the device will be unaffected unless the maximum ratings are exceeded. dc characteristics ? digital section (voltages referenced to gnd) v ee = gnd, except where noted symbo l parameter condition v cc v guaranteed limit unit ?55 to 25 c 85 c 125 c v ih minimum high?level input voltage, channel?select or enable inputs r on = per spec 2.0 3.0 4.5 6.0 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 v v il maximum low?level input voltage, channel?select or enable inputs r on = per spec 2.0 3.0 4.5 6.0 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 v i in maximum input leakage current on digital pins (enable/a/b/c) v in = v cc or gnd 6.0 0.1 1.0 1.0 a i cc maximum quiescent supply current (per package) v in(digital) = v cc or gnd v in(analog) = gnd 6.0 2 20 40 a this device contains protection circuitry to guard against damage due to high static voltages or electric fields. however, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high?impedance cir- cuit. for proper operation, v in and v out should be constrained to the range gnd (v in or v out ) v cc . unused inputs must always be tied to an appropriate logic voltage level (e.g., either gnd or v cc ). unused outputs must be left open.
mc74hc4851a, mc74hc4852a www. onsemi.com 4 dc characteristics ? analog section symbo l parameter condition v cc guaranteed limit unit ?55 to 25 c 85 c 125 c r on maximum ?on? resistance v in = v il or v ih ; v is = v cc to gnd (note 1); i s 2.0 ma (note 2) 2.0 3.0 4.5 6.0 1700 1100 550 400 1750 1200 650 500 1800 1300 750 600 r on delta ?on? resistance v in = v il or v ih ; v is = v cc /2 (note 1); i s 2.0 ma (note 2) 2.0 3.0 4.5 6.0 300 160 80 60 400 200 100 80 500 240 120 100 i off maximum off?channel leakage current, any one channel common channel v in = v cc or gnd 6.0 0.1 0.1 0.1 0.1 0.1 0.1 a i on maximum on?channel leakage channel?to?channel v in = v cc or gnd 6.0 0.1 0.1 0.1 a 1. v is is the input voltage of an analog i/o pin. 2. i s is the currebnt flowing in or out of analog i/o pin. ac characteristics (c l = 50 pf, input t r = t f = 6 ns) symbol parameter v cc ?55 to 25 c 85 c 125 c unit t phl , t plh maximum propagation delay, analog input to analog output 2.0 3.0 4.5 6.0 160 80 40 30 180 90 45 35 200 100 50 40 ns t phl , t phz,pzh t plh , t plz,pzl maximum propagation delay, enable or channel?select to analog output 2.0 3.0 4.5 6.0 260 160 80 78 280 180 90 80 300 200 100 80 ns c in maximum input capacitance digital pins (all switches off) any single analog pin (all switches off) common analog pin 10 35 40 10 35 40 10 35 40 pf c pd power dissipation capacitance typical 5.0 20 pf injection current coupling specifications (v cc = 5v, t a = ?55 c to +125 c) symbol parameter condition typ max unit v out maximum shift of output voltage of enabled analog channel i in * 1 ma, r s 3,9 k i in * 10 ma, r s 3,9 k i in * 1 ma, r s 20 k i in * 10 ma, r s 20 k 0.1 1.0 0.5 5.0 1.0 5.0 2.0 20 mv * i in = total current injected into all disabled channels.
mc74hc4851a, mc74hc4852a www. onsemi.com 5 figure 6. typical on resistance v cc = 2v figure 7. typical on resistance v cc = 3v figure 8. typical on resistance v cc = 4.5v figure 9. typical on resistance v cc = 6v v in , input voltage (volts), referenced to gnd r on , on resistance (ohms) -55 c +25 c +125 c v in , input voltage (volts), referenced to gnd r on , on resistance (ohms) -55 c +25 c +125 c v in , input voltage (volts), referenced to gnd r on , on resistance (ohms) -55 c +25 c +125 c v in , input voltage (volts), referenced to gnd r on , on resistance (ohms) -55 c +25 c +125 c 1100 1000 900 800 700 600 500 400 300 200 100 0 1100 1000 900 800 700 600 500 400 300 200 100 0 660 600 540 480 420 360 300 240 180 120 60 0 440 400 360 320 280 240 200 160 120 80 40 0 0.0 0.9 1.8 2.7 3.6 4.5 0.0 1.2 2.4 3.6 4.8 6.0 0.0 0.4 0.8 1.2 1.6 2.0 0.0 0.6 1.2 1.8 2.4 3.0
mc74hc4851a, mc74hc4852a www. onsemi.com 6 figure 10. injection current coupling specification current source hp4155c smu #2 vin1 = 4.9 v (smu3) iin1 measure here vm1 connected here. vin2 / iin2 meas. here. gnd or v ss 3 notes: rs = 3.9 k or 20 k . notes: vm1 & vm2 are internal notes: hp4155c voltmeters. 16 4 13 6 8 external dc p.s. v cc = 5 v x vout vm2 connected here. x7 x0 rs
mc74hc4851a, mc74hc4852a www. onsemi.com 7 channel 1 channel 2 channel 3 channel 4 channel 5 channel 6 channel 7 channel 8 common out v cc hc4051a microcontroller a/d - input v cc 5v 6v 5v sensor (8x identical circuitry) figure 11. actual technology requires 32 passive components and one extra 6v regulator to suppress injection current into a standard hc4051 multiplexer channel 1 channel 2 channel 3 channel 4 channel 5 channel 6 channel 7 channel 8 common out v cc hc4851a microcontroller a/d - input v cc 5v sensor (8x identical circuitry) figure 12. mc74hc4851a solution solution by applying the hc4851a multiplexer
mc74hc4851a, mc74hc4852a www. onsemi.com 8 figure 13. on resistance test set?up plotter mini computer programmable power supply dc analyzer v cc device under test + - analog in common out gnd figure 14. maximum off channel leakage current, any one channel, test set?up off off 6 8 16 common o/i v cc v ih nc a v cc v ee v cc figure 15. maximum off channel leakage current, common channel, test set?up off off 6 8 16 common o/i v cc v ih analog i/o v cc v ee v cc a figure 16. maximum on channel leakage current, channel to channel, test set?up on off 6 8 16 common o/i v cc v il v cc v ee v cc n/c a analog i/o figure 17. propagation delays, channel select to analog out figure 18. propagation delay, test set?up channel select to analog out v cc gnd channel select analog out 50% t plh t phl 50% on/off 6 8 16 v cc c l * *includes all probe and jig capacitance channel select test point common o/i off/on analog i/o v cc
mc74hc4851a, mc74hc4852a www. onsemi.com 9 figure 19. propagation delays, analog in to analog out figure 20. propagation delay, test set?up analog in to analog out figure 21. propagation delays, enable to analog out figure 22. propagation delay, test set?up enable to analog out v cc gnd analog in analog out 50% t plh t phl 50% on 6 8 16 v cc c l * *includes all probe and jig capacitance test point common o/i analog i/o on/off 6 8 enable v cc enable 90% 50% 10% t f t r v cc gnd analog out t pzl analog out t pzh high impedance v ol v oh high impedance 10% 90% t plz t phz 50% 50% analog i/o c l * test point 16 v cc 10k 1 2 1 2 position 1 when testing t phz and t pzh position 2 when testing t plz and t pzl figure 23. power dissipation capacitance, test set?up 6 8 16 v cc channel select nc common o/i analog i/o v cc a 11 v cc
mc74hc4851a, mc74hc4852a www. onsemi.com 10 figure 24. diagram of bipolar coupling mechanism appears if v in exceeds v cc , driving injection current into the substrate figure 25. function diagram, hc4851a + + + p+ p+ n - substrate (on v cc potential) gate = v cc (disabled) common analog output v out > v cc disabled analog mux input v in > v cc + 0.7v injection 13 injection 14 injection 15 injection 12 injection 1 injection 5 injection 2 injection 4 injection 3 6 9 10 11 a b c e nable x 0 x 1 x 2 x 3 x 4 x 5 x 6 x 7 x current current current current current current current current current control control control control control control control control control
mc74hc4851a, mc74hc4852a www. onsemi.com 11 figure 26. function diagram, hc4852a injection 13 injection 14 injection 13 15 injection 12 injection 1 injection 5 injection 2 injection 4 injection 3 6 9 10 a b enable x0 x1 x2 x3 y0 y1 y2 y3 y injection 3 x current control current control current control current control current control current control current control current control current control current control
mc74hc4851a, mc74hc4852a www. onsemi.com 12 ordering information device package shipping ? mc74hc4851adg soic?16 (pb?free) 48 units / rail mc74hc4851adr2g 2500 units / tape & reel nlvhc4851adr2g* 2500 units / tape & reel mc74hc4851adtr2g tssop?16 (pb?free) 2500 units / tape & reel NLVHC4851ADTR2G* mc74hc4851adwr2g soic?16 wide (pb?free) 1000 units / tape & reel nlvhc4851adwr2g* nlv74hc4851amntwg*# qfn16 (pb?free) 3000 units / tape & reel nlv74hc4851amn1twg*# (in development) 3000 units / tape & reel mc74hc4852adg soic?16 (pb?free) 48 units / rail mc74hc4852adr2g 2500 units / tape & reel nlv74hc4852adr2g* 2500 units / tape & reel mc74hc4852adtr2g tssop?16 (pb?free) 2500 units / tape & reel nlvhc4852adtr2g* ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable. #mn suffix is with pull?back lead, mn1 is without pull?back lead. refer to ?detail a? of case outline on page 16.
mc74hc4851a, mc74hc4852a www. onsemi.com 13 package dimensions tssop?16 dt suffix case 948f issue b ??? ??? ??? dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c ??? 1.20 ??? 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.18 0.28 0.007 0.011 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane -w-. section n?n seating plane ident. pin 1 1 8 16 9 detail e j j1 b c d a k k1 h g s u 0.15 (0.006) t s u 0.15 (0.006) t s u m 0.10 (0.004) v s t 0.10 (0.004) ?t? ?v? ?w? 0.25 (0.010) 16x ref k n n 7.06 16x 0.36 16x 1.26 0.65 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc74hc4851a, mc74hc4852a www. onsemi.com 14 package dimensions soic?16 wb dw suffix case 751g?03 issue d d 14x b 16x seating plane s a m 0.25 b s t 16 9 8 1 h x 45 m b m 0.25 h 8x e b a e t a1 a l c notes: 1. dimensions are in millimeters. 2. interpret dimensions and tolerances per asme y14.5m, 1994. 3. dimensions d and e do not inlcude mold protrusion. 4. maximum mold protrusion 0.15 per side. 5. dimension b does not include dambar protrusion. allowable dambar protrusion shall be 0.13 total in excess of the b dimension at maximum material condition. dim min max millimeters a 2.35 2.65 a1 0.10 0.25 b 0.35 0.49 c 0.23 0.32 d 10.15 10.45 e 7.40 7.60 e 1.27 bsc h 10.05 10.55 h 0.25 0.75 l 0.50 0.90 q 0 7 11.00 16x 0.58 16x 1.62 1.27 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc74hc4851a, mc74hc4852a www. onsemi.com 15 package dimensions soic?16 d suffix case 751b?05 issue k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 18 16 9 seating plane f j m r x 45 g 8 pl p ?b? ?a? m 0.25 (0.010) b s ?t? d k c 16 pl s b m 0.25 (0.010) a s t dim min max min max inches millimeters a 9.80 10.00 0.386 0.393 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.229 0.244 r 0.25 0.50 0.010 0.019 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 6.40 16x 0.58 16x 1.12 1.27 dimensions: millimeters 1 pitch 16 89 8x
mc74hc4851a, mc74hc4852a www. onsemi.com 16 package dimensions qfn16, 2.5x3.5, 0.5p case 485aw issue o dim min max millimeters a a1 0.00 0.05 a3 b 0.20 0.30 d 2.50 bsc d2 0.85 1.15 e 3.50 bsc e2 e 0.50 bsc k 0.20 --- notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimensions b applies to plated terminal and is measured between 0.15 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. 0.20 ref b d2 l pin one e2 1 8 15 10 d e b a c 0.15 c 0.15 2x 2x e 2 16x 16x 0.10 c 0.05 c a b note 3 a 16x k a1 (a3) seating plane c 0.08 c 0.10 0.80 1.00 l 0.35 0.45 1.85 2.15 l1 detail a l alternate terminal constructions l ??? *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 2.80 3.80 1.10 0.50 0.60 16x 0.30 16x dimensions: millimeters 1 reference top view side view note 4 c 0.15 c a b 0.15 c a b detail a bottom view e/2 l1 --- 0.15 2.10 pitch package outline p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 mc74hc4851a/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. ?

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